IN MOLD ELECTRONICS MARKET SIZE AND SHARE ANALYSIS - GROWTH TRENDS AND FORECASTS (2024-2031)
The In Mold Electronics Market is estimated to be valued at US$ 228.73 Mn in 2024 and is expected to reach US$ 1,248.4 Mn by 2031, growing at a compound annual growth rate (CAGR) of 27.4% from 2024 to 2031.
Report Description:
The in mold electronics market is projected to grow significantly in the coming years. In mold electronics is a technology that involves the integration of electronic circuits into injection molded plastic parts during the molding process. This novel technique helps embed electronic functionality like sensing, lighting and others directly into molded plastic components. Several advantages such as decreased assembly steps, compact design, durability and mass customization is driving the demand for in mold electronics across various industries. Electronic manufacturers are increasingly adopting this technology to produce innovative products and cater to evolving customer preferences. The global in mold electronics market is expected to witness double digit growth over the next decade attributed to growing applications in automotive, building automation, consumer goods and medical sectors.
Market Dynamics:
The global in mold electronics market growth is primarily driven by growing automation needs across various industry verticals. Manufacturers are actively looking to integrate electronic components into their products to add functions like sensing, displays and more. This helps make products smarter. Additionally, the ability to produce customized parts with embedded electronics in a cost-effective manner is boosting adoption. However, high initial investment for tooling and small scale production challenges are restraining faster market growth. Moreover, the integration of electronics close to plastic parts can cause overheating issues which needs to be addressed. On the positive side, ongoing advancements in printing technologies, miniaturization of ICs and new conductive materials are presenting significant opportunities for market participants. Once scaled, in mold electronics can enable mass production of IoT products.
Key features of the study:
- This report provides in-depth analysis of the global in mold electronics market, and provides market size (US$ Million) and compound annual growth rate (CAGR%) for the forecast period (2024–2031), considering 2023 as the base year
- It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
- This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
- It profiles key players in the global in mold electronics market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies
- Key companies covered as a part of this study include DuPont de Numours, TactoTek Oy, Golden Valley Products, Butler Technologies, GenesInk, YOMURA, InMold Solutions, Eastprint Incorporated, DuraTech Industries, BotFactory, Canatu, CERADROP, Lite-On Technology, MesoScribe Technologies, Nagase America Corporation, nScrypt Inc., Optomec, Pulse Electronics, Tangio Printed Electronics, and Nissha Co. Ltd
- Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
- The global in mold electronics market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
- Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global in mold electronics market.
Market Segmentation
Table of Contents
*Browse 60 market data tables and 40 figures on "Global In Mold Electronics Market - forecast to 2031”.
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