Memory packaging is the process of assembling tiny semiconductor chips into a more durable form so that they can be easily integrated into computer systems. This can be done in a variety of ways. These packages have pins that connect to the motherboard and provide two communications lines for the memory module and the system. They are available in 168, 100, and 184 pin configurations. They are also known as small outline DIMMs (SO-DIMM). These are similar to DIMMs but use different pin settings. These are commonly used in laptop computers. They are often used in low-end and mid-range notebook computers.
Market Dynamics:
The memory packaging market is growing rapidly as the industry seeks to increase its performance and capabilities while shrinking its footprint. This is happening at a time when demand for memory chips in mobile devices and computing is increasing. The global market for memory packaging is expected to continue grow at a rapid pace. These growth rates are primarily driven by increasing demand from consumer electronics, which is expected to continue increasing in the future.
On the other hand, challenges associated with the outsourced semiconductor assembly and test (OSAT) industry is expected to hinder the market growth.
Key features of the study:
- This report provides in-depth analysis of the global memory packaging market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2023–2030), considering 2022 as the base year
- It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
- This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
- It profiles key players in the global memory packaging market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies
- Key companies covered as a part of this study include Tianshui Huatian Technology Co Ltd, Hana Micron Inc., lingsen precision industries Ltd, Formosa Advanced Technologies Co. Ltd (FATC), Advanced Semiconductor Engineering Inc. (ASE Inc.), Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd, Powertech Technology, King Yuan Electronics Corp. Ltd, ChipMOS Technologies Inc., TongFu Microelectronics Co., and Signetics Corporation
- Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
- The global memory packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
- Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global memory packaging market
Detailed Segmentation:
- Global Memory Packaging Market, By Platform
- Flip-chip
- Lead-frame
- Wafer-level Chip-scale Packaging (WLCSP)
- Through-Silicon Via (TSV)
- Wire-bond
- Application
- NAND Flash Packaging
- NOR Flash Packaging
- DRAM Packaging
- Other Applications
- Global Memory Packaging Market, By End User
- IT and Telecom
- Consumer Electronics
- Embedded Systems
- Automotive
- Other End Users
- Global Memory Packaging Market, By Region
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
- Company Profiles
- Tianshui Huatian Technology Co Ltd
- Hana Micron Inc.
- lingsen precision industries Ltd
- Formosa Advanced Technologies Co. Ltd (FATC)
- Advanced Semiconductor Engineering Inc. (ASE Inc.)
- Amkor Technology Inc.
- Jiangsu Changjiang Electronics Technology Co. Ltd
- Powertech Technology
- King Yuan Electronics Corp. Ltd
- ChipMOS Technologies Inc.
- TongFu Microelectronics Co.
- Signetics Corporation
