Manufacturing semiconductors, microcircuits, and microchips requires extremely precise conditions to be kept in the production/processing area. Hygroscopic components are typically employed in semiconductor manufacturing or processing, making them extremely vulnerable to high humidity levels. Excessive moisture in the assembly area during the manufacture of semiconductors and integrated circuits negatively impacts the bonding process and raises faults. Circuit lines are covered with photosensitive polymer compounds called photoresists before being etched. They absorb moisture due to their hygroscopic nature, which causes the minuscule circuit wires to be cut or bridged, resulting in circuit failure.
Market Dynamics
The ongoing demand for consumer electronics with the advancement of technology is driving growth of the global semiconductor assembly and testing services market. The high development of cell phones and tablets is one of the potential markets for semiconductor assembly and testing services (SATS). Increasing mobility and growing digital content are expected to drive growth of the global semiconductor assembly and testing services market’s growth during the forecast period. Increasing demand for automotive electronics in the upcoming generation of cars built with electronic components, systems to enhance car safety, and management systems are driving growth of the global semiconductor assembly and testing services market. Rising adoption of latest technologies in navigation, hybrid electric drivers, and LEDs creates demand for this market.
Key features of the study:
- This report provides an in-depth analysis of the global semiconductor assembly and testing services market size (US$ Billion) and compound annual growth rate (CAGR %) for the forecast period (2023-2030), considering 2022 as the base year
- It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
- This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, regional outlook, and competitive strategies adopted by the leading market players
- It profiles leading players in the global semiconductor assembly and testing services market based on the following parameters – company overview, financial performance, product portfolio, geographical presence, market capital, key developments, strategies, and future plans
- Companies covered as a part of this study are ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies Inc.), STATS chipPAC Ltd. (JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.
- Insights from this report would allow marketers and management authorities of companies to make informed decisions regarding future product launches, product upgrades, market expansion, and marketing tactics
- The global semiconductor assembly and testing services market report caters to various stakeholders in this industry including investors, suppliers, managed service providers, third-party service providers, distributors, new entrants, and value-added resellers
- Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global semiconductor assembly and testing services market
Detailed Segmentation
- Global Semiconductor Assembly And Testing Services Market, By Service:
- Assembly & Packaging Services
- Testing Services
- Global Semiconductor Assembly And Testing Services Market, By Packaging Solutions:
- Copper Wire and Gold Wire Bonding
- Copper Clip
- Flip Chip
- Wafer Level Packaging
- TSV
- Global Semiconductor Assembly And Testing Services Market, By Application:
- Communication
- Computing & Networking
- Consumer Electronics
- Industrial
- Automotive Electronics
- Global Semiconductor Assembly And Testing Services Market, By Region:
- North America
- Europe
- By Country
- Germany
- U.K.
- France
- Italy
- Spain
- Russia
- Rest of Europe
- Asia Pacific
- By Country
- China
- India
- Japan
- Australia
- South Korea
- ASEAN
- Rest of Asia Pacific
- Latin America
- By Country
- Brazil
- Mexico
- Rest of Latin America
- Middle East and Africa
- By Country/Region:
- GCC Countries
- South Africa
- Rest of Middle East and Africa
- Company Profiles
- ASE Group
- Powertech Technology Inc.
- Global Foundries Inc.
- Amkor Technology Inc.
- CORWIL Technology Corp.
- Integrated Microelectronics Inc. (Psi Technologies Inc.)
- STATS chipPAC Ltd. (JCET)
- Chipbond Technology Corporation
- Silicon Precision Industries Company Ltd.
