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  • Published In : Jul 2022
  • Code : CMI2532
  • Pages : 188
  • Formats :
      Excel and PDF
  • Industry : Semiconductors
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Semiconductor equipment is an electronic circuit component that is neither a good conductor nor a good insulator, which exploits the electronic properties of semiconductor material, such as silicon, germanium, and gallium arsenide, as well as organic semiconductors. Such devices have found wide applications in compactness optical sensors, power devices as well as light emitters, owing to their compactness, reliability, and low cost.

Semiconductor equipment have replaced the thermionic devices or vacuum tubes in most applications. A single integrated circuit (IC), such as a microprocessor chip, requires its own electric generating plant to work in replacement of set of vacuum tubes for enhancing the high-speed of optoelectronic applications. Furthermore, semiconductor equipment have found use in the designing of logic gates and digital circuits, high voltage applications, analog circuits, automobiles, amplifiers and microprocessors, LED lights.

Market Dynamics

The global semiconductor equipment market growth is attributed to rise in demand for various modern gadgets such as smart phones and laptop.  The smart phone and laptops are embedded with millions of tiny transistors to empower various functionalities such as low voltage and high speed optimized embedded SRAMs, radiation hardened embedded SRAMs and custom embedded SRAM solutions, etc.  Moreover, a rising disposable income increases the probability of consumer spending on consumer electronics, which is leading to higher potential sales of consumer electronics such as smartphones, tablets, laptops, and gaming consoles. As there is high demand for smartphones in emerging economies such as India, China, Japan etc., the instances of smartphone adoption are very high among the urban population as compared to the rural population. These factors are expected to drive the market growth during the forecast period 2022-2030.

Key features of the study:

  • This report provides an in-depth analysis of the global semiconductor equipment market size (US$ Billion) and compound annual growth rate (CAGR %) for the forecast period (2022-2030), considering 2021 as the base year
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, regional outlook, and competitive strategies adopted by the leading  market players
  • It profiles leading players in the global semiconductor equipment market based on the following parameters – company overview, financial performance, product portfolio, geographical presence, market capital, key developments, strategies, and future plans
  • Companies covered as a part of this study include Applied Materials, Inc., ASML Holding, Canon, Tokyo Electron, Lam Research Corp., KLA-Tencor, Dainippon Screen, Advantest, Teradyne, and Hitachi High-Technologies
  • Insights from this report would allow marketers and management authorities of companies to make informed decisions regarding future product launches, product upgrades, market expansion, and marketing tactics
  • The global semiconductor equipment market report caters to various stakeholders in this industry including investors, suppliers, managed service providers, third-party service providers, distributors, new entrants, and value-added resellers
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global semiconductor equipment market

Detailed Segmentation

  • Global Semiconductor Equipment Market, By Product Type:
    • Semiconductor Front-end Equipment
    • Semiconductor Back-end Equipment
  • Global Semiconductor Equipment Market, By Application:
    • Discrete Semiconductor
    • Optoelectronic Device
    • Sensors
    • Integrated Circuits
  • Global Semiconductor Equipment Market, By Equipment:
    • Wafer Processing
    • Assembly & Packaging
    • Testing Equipment
  • Global Semiconductor Equipment Market, By End Use:
    • PCs
    • Mobile Handsets
    • Televisions Assembly & Packaging
  • Global Semiconductor Equipment Market, By Region:
    • North America
      • By Country:
        • U.S.
        • Canada
    • Europe
      • By Country:
        • Germany
        • Italy
        • U.K.
        • France
        • Russia
        • Rest of Europe
    • Asia Pacific
      • By Country:
        • China
        • India
        • Japan
        • Australia
        • South Korea
        • ASEAN
        • Rest of Asia Pacific
    • Latin America
      • By Country:
        • Brazil
        • Mexico
        • Argentina
        • Rest of Latin America
    • Middle East and Africa
      • By Country/Region:
        • GCC Countries
        • South Africa
        • Rest of Middle East and Africa
  • Company Profiles
    • Applied Materials, Inc.
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/ Updates
    • ASML Holdings
    • Canon
    • Tokyo Electron
    • Lam Research Corp.
    • KLA-Tencor
    • Dainippon Screen
    • Advantest
    • Teradyne
    • Hitachi High-Technologies

 “*” marked represents similar segmentation in other categories in the respective section.

Detailed Segmentation

  • Global Semiconductor Equipment Market, By Product Type:
    • Semiconductor Front-end Equipment
    • Semiconductor Back-end Equipment
  • Global Semiconductor Equipment Market, By Application:
    • Discrete Semiconductor
    • Optoelectronic Device
    • Sensors
    • Integrated Circuits
  • Global Semiconductor Equipment Market, By Equipment:
    • Wafer Processing
    • Assembly & Packaging
    • Testing Equipment
  • Global Semiconductor Equipment Market, By End Use:
    • PCs
    • Mobile Handsets
    • Televisions Assembly & Packaging
  • Global Semiconductor Equipment Market, By Region:
    • North America
      • By Product Type:
        • Semiconductor Front-end Equipment
        • Semiconductor Back-end Equipment
      • By Application:
        • Discrete Semiconductor
        • Optoelectronic Device
        • Sensors
        • Integrated Circuits
      • By Equipment:
        • Wafer Processing
        • Assembly & Packaging
        • Testing Equipment
      • By End Use:
        • PCs
        • Mobile Handsets
        • Televisions Assembly & Packaging
      • By Country:
        • U.S.
        • Canada
    • Europe
      • By Product Type:
        • Semiconductor Front-end Equipment
        • Semiconductor Back-end Equipment
      • By Application:
        • Discrete Semiconductor
        • Optoelectronic Device
        • Sensors
        • Integrated Circuits
      • By Equipment:
        • Wafer Processing
        • Assembly & Packaging
        • Testing Equipment
      • By End Use:
        • PCs
        • Mobile Handsets
        • Televisions Assembly & Packaging
      • By Country:
        • Germany
        • Italy
        • U.K.
        • France
        • Russia
        • Rest of Europe
    • Asia Pacific
      • By Product Type:
        • Semiconductor Front-end Equipment
        • Semiconductor Back-end Equipment
      • By Application:
        • Discrete Semiconductor
        • Optoelectronic Device
        • Sensors
        • Integrated Circuits
      • By Equipment:
        • Wafer Processing
        • Assembly & Packaging
        • Testing Equipment
      • By End Use:
        • PCs
        • Mobile Handsets
        • Televisions Assembly & Packaging
      • By Country:
        • China
        • India
        • Japan
        • Australia
        • South Korea
        • ASEAN
        • Rest of Asia Pacific
    • Latin America
      • By Product Type:
        • Semiconductor Front-end Equipment
        • Semiconductor Back-end Equipment
      • By Application:
        • Discrete Semiconductor
        • Optoelectronic Device
        • Sensors
        • Integrated Circuits
      • By Equipment:
        • Wafer Processing
        • Assembly & Packaging
        • Testing Equipment
      • By End Use:
        • PCs
        • Mobile Handsets
        • Televisions Assembly & Packaging
      • By Country:
        • Brazil
        • Mexico
        • Argentina
        • Rest of Latin America
    • Middle East and Africa
      • By Product Type:
        • Semiconductor Front-end Equipment
        • Semiconductor Back-end Equipment
      • By Application:
        • Discrete Semiconductor
        • Optoelectronic Device
        • Sensors
        • Integrated Circuits
      • By Equipment:
        • Wafer Processing
        • Assembly & Packaging
        • Testing Equipment
      • By End Use:
        • PCs
        • Mobile Handsets
        • Televisions Assembly & Packaging
      • By Country/Region:
        • GCC Countries
        • South Africa
        • Rest of Middle East and Africa

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