Diamond wire wafer slicing machine is used to cut silicon wafer by using a high-speed spindle, which is fit with a diamond blade. A dicing saw is equipped with the machine which cuts these wafers into individual chips. Materials that are sliced from these machine are silicon, silicon carbide, gallium nitride, gallium arsenide, and ceramic, among others. These wafers are used for production of semiconductors, which in turn, are used in the manufacturing of electronic components.

Shortcomings of conventional slicing machine is one of the major factors driving growth of the market

One of the major factors attributed to growth of the market is restraints in using conventional slicing machines including high volume of wastage while cutting the wafer, low speed of slicing the wafer, and low quality of dices. These factors are driving manufacturers to develop advanced wafer slicing machines, to overcome the challenges associated with conventional machine. For instance, in July 2017, Meyer Burger launched ‘DW288’ diamond wire wafer slicing machine. This machine ensures maximum material utilization while cutting and it requires low electricity while production and this machine also not produces any slurry, which is made of polyethylenglycol (PEG) and silicon carbide (SiC), which further helps in reducing the challenges associated with the recycling of silicon wafer.

Additionally, miniaturization of electronic devices is further propelling demand for small size chips to be incorporated in electronic devices, which in turn is driving demand for diamond wire wafer slicing machines, globally. This is due to higher accuracy of these machines to cut a wafer into smaller sizes as compared to conventional slicer machines. For instance, according to a press release of Apple, Inc., in May 2018, the company announced that it is going to use a 7nm (nanometer) chip for next generation iPhone and the processor will be named as ‘A12’ chip. This chip will be much smaller, faster, and more efficient than 10-nanometer chips, which is being used in current Apple devices such as iPhone 8 and iPhone X. Hence, all these factor will help in propelling growth of the market.

Global Diamond Wire Wafer Slicing Machine Market: Key Trends

Increasing use of large size of wafer is a key trend that is being witnessed in the market. For instance, according to a press release of SEMI, a leading semiconductor manufacturing company, in 2014, Samsung, Intel, and IBM, among others were previously using 300mm diameter wafers, are now switching to 450mm diameter wafer. As the size of wafer increases, it will further increase the number of dies cut from it, which in turn helps in reduction of production cost as well as product wastage while slicing process. Therefore, as the size of wafer increase, it need more efficient machine to provide accurate cuts, and produce more dies from a single wafer.

High cost of machine is one of the major factor restraining growth of the market

High cost of diamond wire wafer slicing machines is a major restraining factor for growth of the market. For instance, according to Coherent Market Insights’ analysis, the cost of 40HP Diamond Wire Machine is US$ 5088.75 per unit and cost of the 60HP Diamond Wire Machine is US$ 6563.75 per unit. Moreover, maintenance cost of these machines is also very high, which is another factor hampering growth of the market.

Global Diamond Wire Wafer Slicing Machine Market: Regional Insights

The market for diamond wire wafer slicing machine in Asia Pacific accounted for largest share in the global market in 2017. The factor attributed to growth of the market is increasing penetration of smartphones, increasing adoption of IoT, self-driving cars, and others. Therefore, rising demand for consumer electronics is leading to high demand for diamond wire wafer slicing machines. For instance, according to the Coherent Market Insights’ analysis, the number of smartphone users in India was 292.6 million in 2016 and it has grown to 342 million in 2017. Increasing demand for smartphones and advancement in smartphone technology has led to development of thinner and smaller ICs. This leads to high demand for diamond wire wafer slicing machine. Hence, this factor will help in propelling growth of the market during the forecasted period.

Moreover, presence of key manufacturers such as Samsung, Sony, LG, Toshiba, Panasonic, Toyota, and Honda makes this region largest consumer of semiconductor ICs, which is another major driving factor leading to high demand for diamond wire wafer slicing machine for cutting wafer. Hence, this factor also helps in fuelling growth of the diamond wire wafer slicing machine in this particular region.

Global Diamond Wire Wafer Slicing Machine Market: Competitive Landscape

Major players operating in the global diamond wire wafer slicing machine market are Dalian Linton NC Machine Co., Ltd, Meyer Burger Technology AG, Slicing Tech,, Diamond Wire Technology, Disco Corporation, Plasma Therm LLC, Tokyo Electron Ltd, ATV Technologies, and EV Group among others.

Key players in the market are focusing on adopting product development strategy, in order to gain competitive edge in the market. For instance, in September 2014, Dalian Linton NC machine co., LTD. launched its new product QPJ1660B diamond wire wafer slicing machine. The production by using this system is clean as it based on water cutting fluid technology, which reduces environmental pollution caused by waste fluid.

Global Diamond Wire Wafer Slicing Machine Market: Taxonomy

By Cutting Technologies

  • Single Wire Slicing
  • Multi Wire Slicing

By Application

  • Mono-crystalline rod
  • Poly-crystalline rod
  • Quartz material

By Region

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East
  • Africa

Research Methodology

Coherent Market Insights followsa comprehensive research methodology focused on providing the most precise market analysis. The company leverages a data triangulation model which helps company to gauge the market dynamics and provide accurate estimates. Key components of the research methodologies followed for all our market reports include:

  • Primary Research (Trade Surveys and Experts Interviews)
  • Desk Research
  • Proprietor Data Analytics Model

In addition to this, Coherent Market Insights has access to a wide range of the regional and global reputed paid data bases, which helps the company to figure out the regional and global market trends and dynamics. The company analyses the industry from the 360 Degree Perspective i.e. from the Supply Side and Demand Side which enables us to provide granular details of the entire ecosystem for each study. Finally, a Top-Down approach and Bottom-Up approach is followed to arrive at ultimate research findings.

Data Triangulation Methodology | Coherent Market Insights

Coherent Market Insights desk research is based on a principle set of research techniques:

  • National level desk research: It Includes research analysis of regional players, regional regulatory bodies, regional trade associations, and regional organization.
  • Multinational level desk research: The research team keeps a track of multinational players, global regulatory bodies, global trade associations, and global organization.

Coherent Market Insights has a large amount of in-house repository of industry database. This is leveraged as a burner for initiating a new research study. Key secondary sources include:

  • Governmental bodies, National and international social welfare institutions, and organizations creating economic policies among others.
  • Trade association, National and international media and trade press.
  • Company Annual reports, SEC filings, Corporate Presentations, press release, news, and specification sheet of manufacturers, system integrators, brick and mortar - distributors and retailers, and third party online commerce players.
  • Scientific journals, and other technical magazines and whitepapers.

Market Analysis | Coherent Market Insights

Preliminary Data Mining

The raw data is obtained through the secondary findings, in house repositories, and trade surveys. It is then filtered to ensure that the relevant information including industry dynamics, trends, and outlook is retained for further research process.

Data Standardization

Holistic approach is used to ensure that the granular and uncommon parameters are taken into consideration to ensure accurate results. The information from the paid databases are further combined to the raw data in order to standardize it.

Coherent Statistical model

We arrive at our final research findings through simulation models. Coherent Data Analytics Model is a statistical tool that helps company to forecast market estimates. Few of the parameters considered as a part of the statistical model include:

  • Micro-economic indicators
  • Macro-economic indicators
  • Environmental indicators
  • Socio-political indicators
  • Technology indicators

Data Processing

Once the findings are derived from the statistical model, large volume of data is process to confirm accurate research results. Data analytics and processing tools are adopted to process large chunk of collected informative data. In case, a client customizes the study during the process, the research finding till then are benchmarked, and the process for new research requirement is initiated again.

Data Validation

This is the most crucial stage of the research process. Primary Interviews are conducted to validate the data and analysis. This helps in achieving the following purposes:

  • It provides first-hand information on the market dynamics, outlook, and growth parameters.
  • Industry experts validates the estimates which helps the company to cement the on-going research study.
  • Primary research includes online surveys, face-to face interviews, and telephonic interviews.

The primary research is conducted with the ecosystem players including, but not limited to:

  • Raw Material Suppliers
  • Manufacturers
  • System Integrators
  • Distributors
  • End-users