onsemi has introduced a new EliteSiC MOSFET in a special T2PAK top-cool package, designed to improve power management for automotive and industrial applications. This new technology aids with better heat management, reliability, and design flexibility for high-power, high-voltage systems used in areas like electric vehicles, solar power, and energy storage.
The EliteSiC MOSFETs are available in 650V and 950V versions and use onsemi’s leading silicon carbide technology. These new devices are now shipping to early customers, with more products expected in late 2025 and beyond. The new T2PAK package provides a more efficient, compact, as well as durable option for customers who need high-performance solutions for demanding applications.
As power demand fuels systems such as solar inverters, EV chargers, as well as industrial power supplies, controlling heat has become a greater challenge. Traditional packaging often forces designers to choose between good heat management as well as high performance. The EliteSiC T2PAK solution solves this problem by transferring heat directly from the circuit board to the system’s cooling system. This leads to:
- Better heat efficiency as well as lower operating temperatures
- Less stress on components, helping systems last longer
- Smaller, more powerful designs
- Easier system design, speeding up time to market
Executive Statement
According to Auggie Djekic, Vice President and Head of SiC Division at onsemi, automotive thermal management is one of the most critical challenges facing power systems designers in automotive and industrial markets today. Power system designers in automotive as well as industrial markets are seeking solutions that deliver efficiency and reliability without compromise. With their EliteSiC technology and the innovative T2PAK top-cool package, customers can unlock superior thermal performance along with design flexibility, strengthening them to create next-generation products that stand out in today’s competitive landscape.