Ultra-Violet (UV) tapes are adhesives tapes that are widely used across the semiconductor industry for protecting semiconductor wafers against grinding and breaking. UV tapes are also used for wafer dicing, wafer back-grinding, and package dicing since they offer additional safety to semiconductor wafers during the back-grinding and dicing process. UV tapes are different from conventional PSA tapes as they are thinner. UV tapes protect the semiconductor wafers seamlessly during the wafer dicing and grinding process. Moreover, these tapes be easily peeled off from the semiconductor wafer after UV irradiation.
The global UV tapes market was estimated to account for US$ 363.2 million in terms of revenue in 2018 and is predicted to grow at a CAGR of 9.4% during the forecast period (2019 to 2027).
Growing demand for UV tapes across the various application as they are environment-friendly and is not get affected in high temperature applications are expected to fuel the market growth of UV tapes. Also, UV tapes provide an excellent setting time when exposed to UV light as compared to PSA-based tapes which are again anticipated to foster the market growth of UV tapes. Moreover, the growing use of UV tapes across emerging application such as optoelectronic components, especially for the manufacturing of camera lenses is further estimated to boost market growth.
Growing application of UV tapes in the back-grinding process, which is an important step in the manufacturing of ultra-thin silicon. This factor is gaining popularity of UV tapes for this process and Ultra-thin wafers significantly contribute to manufacturing energy-efficient end devices at a reasonable cost. Therefore, this factor is changing preference of manufacturer from thin silicon wafers to ultra-thin silicon wafers, which is expected to augment the market growth of UV tapes.
Growing usage of non-UV tapes as they are cost-effective compared to UV tapes is expected to hinder the market growth of UV tapes. Non-UV tapes are manufactured for providing surface protection to semi-conductor wafer while back-grinding process. Moreover, they also meet the changing packaging trend of a semiconductor such as reduce the thickness of the wafer and other changes. Therefore, the rising adoption of non-UV tapes over UV tapes are anticipated to restrict the market growth.
On the basis of product type, Polyolefin (PO) segment dominated the global UV tapes market in 2018 with a 60.1% of market share in terms of revenue, followed by polyethylene terephthalate (PET) and polyvinyl chloride (PVC), respectively.
The growing focus of major countries to increase the production of IC's product is projected to propel the market growth of UV tapes over the forecast period. According to the Electronic weekly.com, investment for IC manufacturing equipment in China is projected to increase to US$ 14.9 billion in 2020 from US$ 12.9 billion in 2019. China accounts for nearly 25% of equipment spend expenditure in the sector making it the world’s second-largest semiconductor equipment market. Therefore, growing expenditure on the production of IC's product will favor the market growth over the forecast timeframe.
The growing interest of UV tapes manufacturers for developing styrene block copolymer-based UV tapes as these can withstand high-temperature applications and are also UV stable is expected to foster the market growth of the UV tapes. Moreover, the growing demand for high-performance adhesives for UV tapes. For instance, in September 2019, Techsil has introduced a new optically clear, low viscosity, UV curable adhesive into the UK market. Vitralit 50004 is a one-component acrylic adhesive designed to use for bonding display screens and laminating optics.
Key players active in the global UV tapes market are:
Raw Material Supplying Companies
By Product Type
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