A three-dimensional integrated circuit (3D IC) is a metal-oxide-semiconductor integrated circuit produced by stacking silicon wafers or dies and interconnecting them vertically. 3D ICs are used as a single device to achieve performance improvements at reduced power and a smaller footprint. In 3D ICs, multiple layers of active electronic components are integrated horizontally and vertically on a single chip. They can be manufactured using various processes such as beam re-crystallization, wafer bonding, and solid-phase crystallization. 3D IC technologies are witnessing massive developments toward management issues related to restricted communications capacity, chip signaling, and memory latency.
The global 3D ICs market is estimated to account for US$ 38,252.9 Mn in terms of value by the end of 2027.
Market Dynamics- Drivers
High growth of electronics market has accelerated innovations such as three-dimensional ICs. Since there has been increase in trend of mobile, fast, compact, and easy to use of products, the global electronics industry is witnessing demand for systems with enhanced performance, optimized working, and minimal response. Similarly, semiconductor chip manufacturers are facing various challenges and constant pressure to enhance performances, while reducing chip sizes. Furthermore, 3D ICs with TSVs provide an enhanced electrical performance due to the very high number of TSV interconnections and short interconnects within stacked ICs. Hence, these factors are expected to drive growth of the global 3D ICs market during the forecast period.
Since 3D ICs provide enhanced memory bandwidth and reduced power consumption, they are being increasingly used in smartphones and tablets. Many players from the semiconductor industry such as fabs and foundries are focused on heterogeneous integration of chip components to enhance user experience, owing to growing popularity of smartphones, e-books, and other mobile devices. Furthermore, 3D ICs with TSV technology allows designers to position stacks of memory chips on top of the graphics processor chip or on application microprocessors, in order to considerably reduce power consumption and enhance memory bandwidth. Therefore, these factors are expected to propel the market growth in the near future.
APAC held dominant position in the global 3D ICs market in 2019, accounting for 47.3% share in terms of value, followed by North America, Europe and RoW respectively.
Figure 1: Global 3D ICs Market Share (%), in terms of Value, By Region, 2019
Market Dynamics- Restraint
There are several issues related to 3D ICs such as thermal effects, which in turn, affect the reliability and resiliency of interconnects in 3D circuits. Examination of thermal issues in 3D integration is compulsory to evaluate the thermal robustness of various 3D design options and technology. 3D ICs offer various advantages; however, these advantages come with considerable disruption in wafer fabs and at a very high cost. For instance, Xilinx, Inc. offers Virtex-7 FPGA VC709 connectivity kit with a price of around US$ 4,995. Therefore, these factors are expected to restrain growth of the market during the forecast period.
Manufacturing of 3D ICs requires fully functional foundries with skilled personnel to operate. Currently, there is a lack of adequate foundries and skilled professionals to manufacture 3D ICs, especially in emerging economies such as Philippines, Brazil, Africa, and Indonesia. Thus, these factors are expected to hinder the global 3D ICs market growth over the forecast period.
|Base Year:||2019||Market Size in 2019:||US$ 7,521.4 Mn|
|Historical Data for:||2016 to 2019||Forecast Period:||2020 to 2027|
|Forecast Period 2020 to 2027 CAGR:||22.5%||2027 Value Projection:||US$ 38,252.9 Mn|
|Companies covered (8):||
Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.
|Restraints & Challenges:||
Majority of companies generate a vast amount of data from their business operations. Furthermore, many organizations use government data, external data from social media and other public sources of data to supplement the internal data. Storage, processing, and transfer of this data are the key challenges faced by these companies. Furthermore, in big data analytics, processors and memory are crucial IC components. 3D IC plays a key role in combining these two components and provides speed, high bandwidth, and lowers power consumption.
Major companies in the market are focused on collaboration activities, in order to gain a competitive edge and enhance the market presence. For instance, in September 2013, TSMC collaborated with Cadence Design Systems Inc. to manufacture a 3D IC reference flow that facilitates innovative 3D stacking. In May 2013, STATS ChipPAC Ltd. collaborated with Qualcomm Technologies Inc. and A*STAR Institute of Microelectronics to deliver technology building blocks for low lost interposers used in 2.5D/3D ICs.
Figure 2: Global 3D ICs Market Value (US$ Mn), 2017 - 2027
The global 3D ICs market was valued at US$ 7,521.4 Mn in 2019 and is forecast to reach a value of US$ 38,252.9 Mn by 2027 at a CAGR of 22.5% between 2020 and 2027.
Multi-chip packaging is one of the emerging trends in the 3D integrated circuit market. In multi-chip packaging, a large number of transistors are packed into a single 3D integrated circuit. This approach enables better interaction among the processor and memory; hence, this type of packaging is essential for memory enhanced applications. Multi-chip packaging is one of the crucial developments that would drive the growth of the 3D ICs market in the near future.
IntSim is a computer-aided design tool used to simulate 2D and 3D integrated circuits. This open-source tool can be used for forecasting 2D or 3D chip power, a number of metal levels, die size, and best possible sizes of metal levels depending on several design parameters and technology. Using this tool, users can study scaling trends and minimize chip designs.
Global 3D ICs Market - Impact of Coronavirus (Covid-19) Pandemic
Due to Covid-19 pandemic, many industries witnessed significant shift in their business. There is significant impact on the growth of 3D ICs market. As manufacturing operations are temporarily suspended across many countries to contain the coronavirus. There is shortage of 3D ICs in the market caused by less production of 3D ICs. Many manufacturing companies such as Samsung, Xiaomi, OPPO and LG Display have suspended their manufacturing operations in China, India, South Korea and in European countries. For instance, in May 2020, OPPO Company has shut down its operations in Noida as six employees test coronavirus positive. Additionally, due to this pandemic, the demand for these 3D IC integrated devices is exacerbated by lockdown imposed in several countries.
Key players operating in the global 3D ICs market are Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.
3D IC is a metal-oxide-semiconductor (MOS) integrated circuit which is produced by stacking silicon wafers or dies and connecting them vertically. These 3D ICs are manufactured by using different processes such as beam re-crystallization, wafer bonding, and solid-phase crystallization. Three dimensional integrated circuit (3D IC) are used to offer high performance, low power consumption, efficiency and increased functionality in the electronic devices. 3D ICs are used in Consumer electronics, communication technologies and military. 3D ICs are majorly used in consumer electronic devices owing to increasing trend towards compact sizes and high efficiency.
Rising awareness for energy efficient and propagation of internet of things (IoT) is expected to drive the growth of 3D ICs market over the forecast period. This is attributed to increasing demand of (IoT) devices in the market. Manufacturers are innovating their products with the help of these 3D ICs. 3D ICs are advanced technology solutions which aids in designing and development of the latest products. Manufacturers are continuously improving the consumer products by reducing the size of the devices. Moreover, these smart devices provides various features such as durability, efficiency in speed and good memory. This is expected to drive the demand of 3D ICs market over the forecast period.
Furthermore, increase in the demand for high performance and compact ICs in laptop, tablets, mobile devices, Smart TVs are also expected to drive the growth of 3D ICs market over the forecast period. Manufacturers are improving these devices by using these 3D ICs to offer high bandwidth and high performance to the end users. Additionally, the rising demand for automated products and high functionality devices are encouraging OEMs to integrate 3D ICs in their devices, which will further create lucrative opportunities for this market.
This report segments the global 3D ICs market on the basis of end-use sectors, substrate type, fabrication process, product and region. On the basis of end-use sectors 3D ICs market is segmented into Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others (Biomedical applications and R&D). On the basis of substrate type, the global 3D ICs market is segmented into Silicon on insulator (SOI), Bulk silicon. On the basis of fabrication process, the global 3D ICs market is segmented into Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization. On the basis of product, the global 3D ICs market is segmented into MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED. On the basis of region, the global 3D ICs market is segmented into North America, Europe, Asia Pacific, ROW.
Key features of the study:
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