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Additive manufacturing has enhanced the rapid prototyping of complex geometrical structures that are created using computer aided designs (CAD). The long lead times for manufacturing has proven additive manufacturing to be beneficial for small batch size production. The global polymers for additive manufacturing market is estimated to surpass US$ 598.9 million by the end of 2027 in terms of revenue, exhibiting a CAGR of 23.0% during the forecast period (2020 to 2027).

Drivers

The development of cost-effective and high-performance polymers for 3D printing is driving the market growth of polymers for additive manufacturing. The Acrylonitrile Butadiene Styrene (ABS) is a strong and durable plastic. While, Polylactic Acid (PLA) is a bio-degradable polymer which possess higher strength and, thus, its filament form is majorly used for DLP (digital light processing), and SL (Stereolithography) processes. However, as the industrial demand for 3D printing is increasing at a rapid rate, several players operating in the additive manufacturing market have started developing advanced polymers. For instance, in April 2021, Evonik Industries AG, a Germany-based specialty chemicals manufacturing company, launched its new product line of photopolymers for 3D printing under its INFINAM brand. As per the company, these polymer resins are most suitable for processes such as DLP and SL owing to their toughness and impact-resistant properties. Furthermore, a few of the players are collaborating with other companies to develop a cost-effective SLS printing process for high-performance polymers. For example, in March 2019, Solvay S.A., a specialty chemicals and advanced materials manufacturing company, had collaborated with a Belgian start-up, Aerosint operating in the selective powder deposition systems market, to develop economically viable SLS printing process for high-performance polymers such as polyphenylene sulfide (PPS) and polyetheretherketone (PEEK).

Among regions, North America held the dominant position in the global polymers for additive manufacturing market in 2019, accounting for 36.2% market share in terms of revenue, followed by Asia Pacific and Europe.

Figure 1. Global Polymers for Additive Manufacturing Market Revenue Share (%), By Region, 2019

Polymers For Additive Manufacturing  | Coherent Market Insights

Market Restraints:

The low durability of parts produced by additive manufacturing is hampering the product demand. The ASTM (American Society for Testing and Materials) International Technical Committee F42 has issued a set of manufacturing processes for additive manufacturing using polymers. Some of these are photopolymerization, material extrusion, powder bed fusion, and material jetting. For example, in photopolymerization, parts are built as a layer at a time by tracing laser or UV (Ultraviolet) beam on the liquid polymer. The parts derived using this manufacturing process are not durable as compared to other processes. Moreover, lower tensile strength associated with the polymers such as Acrylonitrile Butadiene Styrene (~33 MPa) as compared to plastics such as Polyethylene Terephthalate (~55 MPa) has further restrained the demand for polymers in additive manufacturing to some extent.

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Polymers for Additive Manufacturing Market Report Coverage

Report Coverage Details
Base Year: 2019 Market Size in 2019: US$ 147.6  Mn
Historical Data for: 2017 and 2018 Forecast Period: 2020 to 2027
Forecast Period 2020 to 2027 CAGR: 23.0% 2027 Value Projection: US$ 598.9 Mn
Geographies covered:
  • Regions: North America, Latin America, Europe, Asia Pacific, and Middle East & Africa
Segments covered:
  • By Process Type: Fused-deposition Modelling (FDM), Stereolithography(SLA), Direct-write, Continuous Liquid Interface Production (CLIP), Selective Laser Sintering (SLS), and Others 
  • By Material: Acrylonitrile Butadiene Styrene (ABS), Polycarbonate (PC), Nylon, Polyvinyl Alcohol (PVA), PolylacticAcid (PLA), Acrylonitrile Styrene Acrylate (ASA), and Others
  • By Application- For Electronics: Radio Frequency Components, Antenna, Sensors, PCB's (Printed Circuit Boards), and Others
Companies covered:

Arkema S.A., Covestro AG, DuPont, Inc., EOS GmbH, Evonik Industries AG, INTAMSYS, Prototal Industries, Stratasys Ltd., BASF SE, Saudi Basic Industries Corporation (SABIC), Huntsman International LLC., NatureWorks LLC

Growth Drivers:
  • Development of cost-effective and high-performance polymers for 3D printing
  • Increasing awareness about environmental crisis
Restraints & Challenges:
  • Lower durability of parts produced by additive manufacturing

Market Opportunity

The persistent product development by 3D printing manufacturers is projected to offer lucrative opportunities to players in the near future. For instance, an American-Israeli manufacturer of 3D printers and 3D production systems named Stratasys Ltd. started delivering its polymers to several addictive manufacturing companies through its subsidiary company named Makerbot. The collaboration has permitted MakerBot to launch the METHOD Carbon Fiber Edition polymer in May 2020. This product launch is expected to enable engineers to print strong and accurate parts for manufacturing tools, thereby, creating an opportunity for MakerBot to widen its product portfolio.

Figure 2. Global Polymers for Additive Manufacturing Market Revenue Share (%), By Application- For Electronics, 2019

Polymers For Additive Manufacturing  | Coherent Market Insights

On the basis of application- for electronics, in 2019, the sensors segment accounted for 36.2% of the revenue share. Precision and elegant techniques are needed in the manufacturing of the sensors, polymers for additive manufacturing process has been utilized in fabrication of sensors in the last few years. Polymers for additive manufacturing has become a common fabrication technique for an extensive range of engineering components in several industries such as healthcare, manufacturing, and defense.

Global Polymers for Additive Manufacturing Market - Impact of Coronavirus (Covid-19) Pandemic

The polymers for additive manufacturing market has faced some negative impact on the supply and manufacturing globally due to the lockdown. Imposition of lockdown resulted in the shutting down of businesses and ceasing of several economic activities for many electronic product manufacturing companies. For instance, two of the prominent polycarbonate manufacturing plants of SABIC and Covestro AG in the U.S. had witnessed shutdown in the initial days of the pandemic which were further restarted in August 2020. Moreover, China one of the major producers of electronic products across the globe, hindrance in the supply chain of raw materials like plastics and chemicals has hampered due to the pandemic and impacted the market growth.

Competitive Section

Key players operating in the global polymers for additive manufacturing market include Arkema S.A., Covestro AG, DuPont, Inc., EOS GmbH, Evonik Industries AG, INTAMSYS, Prototal Industries, Stratasys Ltd., BASF SE, Saudi Basic Industries Corporation (SABIC), Huntsman International LLC., NatureWorks LLC.

Polymers for additive manufacturing have been gaining high demand due to the rise and expansion of the 3D printing market all over the globe. Additive manufacturing enables the fabrication of geometrically complex structures with reduced fabrication and costs. The synthetic adaptability of the finished products can be achieved using polymer materials have been gaining high demand all over the globe and have also been one of the widely researched class of materials for its applications in the additive manufacturing market. The application of additive manufacturing in the electronics application has favored the growth and rise of the polymers for additive manufacturing market all over the globe. According to Coherent Market Insights analysis, over 65% demand for 3D printing comes from the electronics, industrial or consumer goods industry. Moreover the rising adoption of 3D printing for production of electrical components such as radio frequency components, antenna, sensors, PCB's (Printed Circuit Boards), and others has also played a vital role in the rise and expansion of the polymers for additive manufacturing market all over the globe.

Based on materials, the Acrylonitrile Butadiene Styrene (ABS) segment held the largest share in the global polymers for additive manufacturing market. The high tensile strength, abrasion resistant, and affordability have also played a vital role in increasing the demand for ABS material in polymers for additive manufacturing market, globally. ABS has been noted to be one of the best materials that are used to print enclosures for electrical or electronic assemblies.

Polymers for additive manufacturing is used in various applications for electronics such as radio frequency components, antenna, sensors, PCB's (Printed Circuit Boards), and others. Hence, increasing demand for polymers for additive manufacturing in sensors market are burgeoning growth of this segment.

Key features of the study:

  • This report provides in-depth analysis of polymers for additive manufacturing market, and provides market size (US$ Million) and compound annual growth rate (CAGR %) for the forecast period (2020-2027), considering 2019 as the base year
  • It elucidates potential revenue opportunity across different segments and explains attractive investment proposition matrix for this market
  • This study also provides key insights about market drivers, restraints, opportunities, and regional outlook.
  • It profiles key players in the global polymers for additive manufacturing market based on the following parameters – company overview, financial performance, product portfolio, geographical presence, distribution strategies, key developments and strategies, and future plans
  • Key companies covered as a part of this study include Arkema S.A., Covestro AG, DuPont, Inc., EOS GmbH, Evonik Industries AG, INTAMSYS, Prototal Industries, Stratasys Ltd., BASF SE, Saudi Basic Industries Corporation (SABIC), Huntsman International LLC., NatureWorks LLC.
  • Insights from this report would allow marketers and management authorities of companies to make informed decision regarding future products launches, technology up gradation, market expansion, and marketing tactics
  • The global polymers for additive manufacturing market report caters to various stakeholders in this industry including investors, suppliers, Polymers for Additive Manufacturing manufacturers, distributors, new entrants, and financial analysts
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global polymers for additive manufacturing market

Detailed Segmentation:

  • Global Polymers for Additive Manufacturing Market, By Process Type:
    • Fused-deposition Modelling (FDM)
    • Stereolithography(SLA)
    • Direct-write
    • Continuous Liquid Interface Production (CLIP)
    • Selective Laser Sintering (SLS)
    • Others
  • Global Polymers for Additive Manufacturing Market, By Material:
    • Acrylonitrile Butadiene Styrene (ABS)
    • Polycarbonate (PC)
    • Nylon
    • Polyvinyl Alcohol (PVA)
    • PolylacticAcid (PLA)
    • Acrylonitrile Styrene Acrylate (ASA)
    • Others
  • Global Polymers for Additive Manufacturing Market, By Applications- For Electronics:
    • Radio Frequency Components
    • Antenna
    • Sensors
    • PCB's (Printed Circuit Boards)
    • Others
  • Global Polymers for Additive Manufacturing Market, By Region:
    • North America
      • U.S.
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Canada
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
    • Europe
      • EU5
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Nordic
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • BENELUX
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Russia
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Poland
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Rest of Europe
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
    • Asia Pacific
      • China
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • PolylacticAcid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • India
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Japan
        • By Application:
          • Additives
          • Intermediates
        • By End-Use Industry:
          • Personal Care
          • Pharmaceutical
          • Agriculture
          • Others
      • ASEAN
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Australia
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • South Korea
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Rest of Asia Pacific
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
    • Latin America
      • Brazil
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Argentina
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Mexico
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Rest of Latin America
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
    • Middle East & Africa
      • Middle East
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
      • Africa
        • By Process Type:
          • Fused-deposition Modelling (FDM)
          • Stereolithography(SLA)
          • Direct-write
          • Continuous Liquid Interface Production (CLIP)
          • Selective Laser Sintering (SLS)
          • Others
        • By Material:
          • Acrylonitrile Butadiene Styrene (ABS)
          • Polycarbonate (PC)
          • Nylon
          • Polyvinyl Alcohol (PVA)
          • Polylactic Acid (PLA)
          • Acrylonitrile Styrene Acrylate (ASA)
          • Others
        • By Application – For Electronics
          • Radio Frequency Components
          • Antenna
          • Sensors
          • PCB's (Printed Circuit Boards)
          • Others
  •  Company Profiles
    • Arkema S.A. *
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments
      • Future Plans
    • Covestro AG
    • DuPont, Inc.
    • EOS GmbH
    • Evonik Industries AG
    • INTAMSYS
    • Prototal Industries
    • Stratasys Ltd.
    • BASF SE
    • Saudi Basic Industries Corporation (SABIC)
    • Huntsman International LLC
    • NatureWorks LLC

“*” marked represents similar segmentation in other categories in the respective section.

Frequently Asked Questions

The global polymers for additive manufacturing market is estimated to surpass US$ 598.9 million by 2027.
The development of cost-effective and high-performance polymers for 3D printing industry is expected to drive the polymers for additive manufacturing market growth during the forecast period.
The persistent product development by 3D printer manufacturers is projected to offer lucrative opportunities for players in the near future.
Lower durability of parts produced by additive manufacturing serve as a restraining factor for the market.
Major players operating in the market include Arkema S.A., Covestro AG, DuPont, Inc., EOS GmbH, Evonik Industries AG, INTAMSYS, Prototal Industries, Stratasys Ltd., BASF SE, Saudi Basic Industries Corporation (SABIC), Huntsman International LLC., NatureWorks LLC.
The market was valued at US$ 147.6 million in terms of revenue in 2019.

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