LG Innotek announced that it has successfully developed a 'Next-Generation Smart IC Substrate' with improved performance and eco-friendly features. This new product reduces carbon emissions during its production by 50%, helping the company cut annual carbon dioxide emissions by 8,500 tons, which is like planting about 1.3 million trees.
The Smart IC Substrate is used in devices like smart cards (credit cards, electronic passports, USIM cards) to transmit information to readers, like when you use a card in an ATM. LG Innotek's new substrate eliminates the need for precious metal plating (like gold or palladium) that is typically used to prevent corrosion and improve signal transmission. This process is not only expensive but also generates a lot of greenhouse gases, so the new product is more eco-friendly.
The new substrate is also three times more durable than previous models, meaning less wear and tear over time, which reduces errors when reading information from smart cards.
LG Innotek began mass production of the substrate in November 2025 and is now supplying it to global smart card makers. The company holds 20 patents for this technology in South Korea and is working on registering patents in other countries like the U.S., Europe, and China. With stricter environmental rules in Europe, LG Innotek is ready to stand out in the global market.
Executive Statement
According to Cho Jitae(Jeffrey Cho), executive vice president and head of LG Innotek's Package Solution Business, the 'Next-Generation Smart IC Substrate' both satisfies customers' ESG requirements and offers technological competitiveness. They will continue presenting innovative products that create differentiated customer value, making them a partner that realizes their customers' visions.
