Tageos and Pragmatic Semiconductor have expanded their partnership to launch new RFID products. The new Tageos EOS Lite and EOS Zero Lite lines use Pragmatic’s flexible NFC Connect chips and slim, eco-friendly designs. They meet the growing need to connect physical products with digital tools.
The EOS-932 Zero Lite PR1301 is a low-cost, eco-friendly paper NFC tag. It can be put on packaging as well as labels to help customers, check products, and support recycling. Its thin, flexible chip fits on curved surfaces or inside products, making it easy to make in large quantities and good for the environment.
These new products allow brands and retailers to:
- Add NFC features without changing packaging appearance
- Lower carbon footprint
- Connect products to smartphones for marketing, authentication, as well as brand protection
Overall, the products make it easier to track, connect, and interact with items in a sustainable, low-cost way.
According to Coherent Market Insights, the RFID Sensor Market is expected to grow at a CAGR of 10.3% from 2025 to 2032. Currently, the market is at USD 23.10 Bn in 2026 and is expected to be around USD 45.94 Bn by 2033. The RFID sensor market is experiencing significant growth due to the increasing adoption of IoT and Industry 4.0 technologies across various sectors. Industries are creating increased demand for real-time asset tracking and supply chain optimization, which is proving beneficial for the market.
"Our close collaboration with Pragmatic Semiconductor combines innovation with a clear vision for sustainability, enabling customers to deliver highly scalable, cost-effective, and truly sustainable NFC inlays for smart packaging applications," said Matthieu Picon, CEO, Tageos. "The new and growing FlexIC-based product lines EOS Lite and EOS Zero Lite are yet another example of our path to success, opening new possibilities for brands to connect to their customers through their products and the consumer's most personal device, the smartphone."
"Bringing this innovation to market is an exciting deployment of our FlexIC technology. With Tageos, we are addressing the rapidly expanding opportunity to seamlessly integrate intelligence at item level and deliver sustainable, connected experiences at scale," said David Moore, CEO, Pragmatic Semiconductor. "Together, we are shaping a new era of smarter packaging, enabling direct consumer engagement with virtually any item to prove authenticity, deepen trust, and unlock data-driven insights and transparency across the value chain."
Source:
News Room: Tageos
Company: Tageos
