Amkor Technology, Inc., a prominent provider of semiconductor packaging and test services, unveiled revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
The facility is well planned on a 104-acre site within the Peoria Innovation Core, in north Peoria, AZ. Peoria City Council unanimously approved a land swap and an amended development agreement, allowing Amkor to exchange its previously designated 56-acre parcel within the Five North at Vistancia community. This initiative will expand the company’s presence in a broad aspect.
The construction initiation will begin within a few days, with production expected to start in early 2028.
As part of Arizona's growing semiconductor ecosystem, Amkor will work with TSMC and other key semiconductor players to leverage advanced, high-volume manufacturing for industries such as computing, communications, and automotive.
Executive Statement
According to Giel Rutten, Amkor’s president and chief executive officer, as the largest advanced packaging company in the U.S., Amkor is proud to invest in U.S. semiconductor manufacturing and strengthen the U.S. semiconductor supply chain. This new site offers the flexibility to meet growing customer demand and reinforces their commitment to U.S.-based chip manufacturing.
According to Peoria Mayor Jason Beck, this is a historic milestone for the partnership between the City of Peoria and Amkor. By securing this land, they are not only bringing a USD 2 billion investment and 2,000 new jobs to their community, but are further solidifying the important role Peoria will play in strengthening America’s critical semiconductor supply chain. This outcome demonstrates the power of strong partnerships and smart long-term planning.