Global Unichip Corp. (GUC), a leader in semiconductor ASIC solutions, launched of its next-generation 2.5D/3D Advanced Packaging Technology (APT) platform, manufactured in order to accelerate design cycles as well as reduce risk for high-performance, high-yield ASICs.
The platform connects TSMC’s latest 3DFabric® technologies with advanced process nodes, enable next-generation designs with a comprehensive solution that spans from silicon-proven IP to 2.5D/3D packaging.
The new platform builds on GUC’s first-generation 2.5D/3D APT platform introduced in 2022. Since then, GUC has closely collaborated with TSMC to incorporate major technological advancements of TSMC in both logic processes and 3DFabric technologies.
TSMC’s evolution from FinFET-based N5/N3 nodes to next-generation nanosheet nodes, N2 and A16 has enabled unprecedented integration density and performance scaling.
Simultaneously, TSMC’s 3DFabric innovations, including CoWoS®, TSMC-SoIC®, and System-on-Wafer (TSMC-SoWTM), allow for advanced 2.5D/3D integration of multiple dies across larger package substrates.
GUC has long teamed up with TSMC closely to develop silicon-proven IP and platform technologies. This ongoing collaboration ensures alignment with TSMC’s latest process and 3DFabric packaging advances, enabling customers to reduce design risk while accelerating time-to-market.
Executive Statement
According to Aveek Sarkar, Director of Ecosystem and Alliance Management Division at TSMC, TSMC has been working closely with our Open Innovation Platform® (OIP) partners like GUC to develop IP solutions for their advanced process and 3DFabric technologies. Their latest collaboration with GUC in enabling its 2.5D/3D platform will help customers accelerate product development cycles and deliver next-generation silicon using their advanced packaging and process technologies.
According to Aditya Raina, CMO of GUC, they were industry-leading with HBM3 PHY and Controller, and again with HBM4 in 2025. Their UCIe IP has demonstrated unmatched 32Gbps speed and is now moving to 64Gbps era. Our Custom GLink-3D 2.0 IP has achieved 40 Tbps/mm² through a lead customer. These achievements mark the dawn of true 3D ASICs.