SK hynix Inc. announced it has completed development of its 321-layer 2Tb QLC NAND flash product and has started its mass production. This success holds the world's first execution of more than 300 layers using QLC technology, marking a new benchmark in NAND density. The product will be released in the first half of next year following completion of global customer validation.
- Introduction of the highest-density QLC product completed, commercial launch scheduled for the first half of next year, following completion of customer validation.
- Expansion of independent operation units ("planes") enables simultaneous large capacity as well as high performance, optimized for ultra-high-capacity eSSDs for AI servers.
SK hynix developed a 2Tb device with double the capacity of existing solutions in order to maximize the cost competitiveness of its new product. In order to address potential performance degradation in large-capacity NAND, the company raised the number of planes, independent operation units within a chip, from 4 to 6. This enables greater parallel processing as well as significantly enhances simultaneous read performance.
The 321-layer QLC NAND delivers both higher capacity as well as improved performance compared to previous QLC products. Bolstering the data transfer speed, improved writing performance by up to 56%, and improved read performance by 18%.
The 321-layer NAND will be applied first to PC SSDs, before expanding to enterprise SSDs (eSSD) for data centers and UFS for smartphones. Supporting its proprietary 32DP technology, which enables the simultaneous stacking of 32 NAND dies in a single package, SK hynix focuses on entering the ultra-high-capacity eSSD market for AI servers by achieving double the integration density.
Executive Statement
According to Jeong Woopyo, Head of NAND Development, with the start of mass production, they have significantly strengthened their high-capacity product portfolio and secured cost competitiveness. They will also make a major leap forward as a full-stack AI memory provider, in line with the explosive growth in AI demand and high-performance requirements in the data center market.
